The McAlpine Research Group has recently demonstrated the 3D printing of encapsulated light-emitting diodes (LEDs), in which every component of the device was 3D printed from the same one-pot custom-built 3D printer (See Figure). Developing the ability to co-3D print various classes of materials possessing distinct properties is a significant challenge which requires overcoming discrepancies in material properties, in addition to ensuring that all of the materials are compatible with the 3D printing process. Extrusion-based 3D printing is an additive manufacturing technique which offers freeform fabrication capabilities. Yet, to date, the 3D printing of electronic components has been mostly limited to the printing of conductors. At the fundamental level, 3D printing should be entirely capable of generating spatially heterogeneous multi-material structures by dispensing a wide range of material classes with disparate functionalities and ink viscosities, including semiconducting nanomaterials, elastomers, organic polymers, and metals. The objective of this proposal is to fully three-dimensionally print silicon nanocrystal LEDs, and to measure and optimize their device performances via 3D interfacial engineering.
435 Amundson Hall, 421 Washington Ave. SE, Minneapolis, MN, 55455
P: 612-626-0713 | F: 612-626-7805